Engineering hardware for people who read datasheets first.
Battery management, automotive compute, IoT gateways, and classroom-ready kits — shipped from Daegu to teams building real systems.
top-down studio shot
on warm-neutral seamless
Four domains, one stack of engineering rigor.
Cell balancing, protection, and ESS/EV-grade stacks from 16S to 192S.
ARM-based automotive AP development boards for ADAS, IVI, and classroom use.
Gateways and sensor nodes for industrial, smart-city, and agritech deployments.
Curriculum-ready kits for university courses in embedded, EV, and automotive networks.
TOPST D3-G
Automotive-grade SBC powered by Telechips TCT8050 Dolphin3 9-core SoC. Quad Cortex-A72 + Quad Cortex-A53 + Cortex-R5, up to 8GB LPDDR4X, DisplayPort 1.4 with multi-display, 3-ch CAN Bus, PCIe 3.0, and RPi HAT+ compatible
Just off the production line.
Every board ships with real docs
Schematics, BOM, reference firmware on Git — no NDAs for catalogue SKUs.
5-year firmware commitment
Security patches and kernel updates until 2031 on all 2026 products.
Stocked in Daegu, global ship
DDP to 40+ countries. EAR99 / ECCN handled at the warehouse.
Engineer-to-engineer support
Your ticket is read by someone who has soldered the board, not a script.